Conference Tutorials take place

Sun, Jul 7th, 2019

Conference Takes Places

Mon, Jul 8th, 2019

IEEE FLEPS Civic Reception

Mon, Jul 8th, 2019

More details

IEEE FLEPS 2019 Banquet Dinner

Tue, Jul 9th, 2019

The 1st edition of the IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019) will be held in Glasgow, Scotland, United Kingdom at the DoubleTree by Hilton Glasgow Central. Glasgow is the largest city in Scotland with a dense concentration of high-tech industry, world-class educational establishments, rich and diverse culture and easy-access to outstanding natural beauty. 

IEEE FLEPS 2019 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems.

The social program will entail a welcome reception and a conference banquet for the attendees and accompanying people. 

The Venue

DoubleTree by Hilton Glasgow Central

The Conference will be held at the DoubleTree by Hilton Glasgow Central. Visit their website to learn more about the venue and Glasgow, Scotland. 

Learn More about the Venue

The Conference Location

Glasgow, Scotland

FLEPS 2019 will be the located in Glasgow, Scotland. Visit People Make Glasgow to learn more about the city. 

Learn More about Glasgow, Scotland

FLEPS 2019 Keynote


The Conference will feature the following keynote speakers this year!

Learn more about this year's Keynote Speakers

Professor Arokia Nathan

Cambridge Touch Technologies, UK

Ultra Low Power Sensor Interfaces for IoT

Professor Takao Someya

University of Tokyo, Japan

Stretchable nanomesh electronics for wearables and in vitro characterizations

Corne Rentrop

Project Leader
Hybrid Printed Electronics Group at the Holst Center, TNO

Fundamentals and applications of hybrid printed Electronics and how to integrate into flexible, stretchable and three-dimensional products.